GRINDING DEVICE

PROBLEM TO BE SOLVED: To provide a grinding device capable of securing high quality grinding in which the corrosion or rusting of a workpiece are suppressed. SOLUTION: The grinding device 1 grinds the workpiece W by rotating a columnar metal bond grinding wheel 3, and passes a current to the metal b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MARUYAMA JIRO, SHIMANO MASAOKI, YAMAMOTO YASUTATSU
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a grinding device capable of securing high quality grinding in which the corrosion or rusting of a workpiece are suppressed. SOLUTION: The grinding device 1 grinds the workpiece W by rotating a columnar metal bond grinding wheel 3, and passes a current to the metal bond grinding wheel 3 and an electrolytic dressing electrode 21 rotating in a state that grinding fluid exists to electrolytically dress the metal bond grinding wheel 3. In the grinding device 1, at a downstream end in a rotating direction of the metal bond grinding wheel 3 in an electrolytic dressing area where the metal bond grinding wheel 3 and an electrode surface 25 of the electrolytic dressing electrode 21 are opposed each other, an electrolytic corrosion preventive plate 35 is provided, and a positive voltage is applied to the electrolytic corrosion preventive plate 35. An OH-ion dissolved in the grinding fluid generated accompanied by the electrolytic dressing is induced by the electrolytic corrosion preventive plate 35 which becomes an anode, thereby eliminating the OH-ion from the grinding fluid. Therefore, the corrosion or rusting of the workpiece W caused by the adhesion of the grinding fluid following the rotating metal bond grinding wheel 3 and scattering is suppressed. COPYRIGHT: (C)2011,JPO&INPIT