PACKAGE BASE, AND METHOD OF MOLDING THE SAME

PROBLEM TO BE SOLVED: To provide a package base that achieves refraction of a light beam of a semiconductor light emitting device by a non-common-use surface, adjustment of the light beam to a predetermined direction, and convergence on a predetermined position simultaneously, and to provide a method of molding the package base. SOLUTION: The method of molding the package base includes the steps of: preparing a semiconductor substrate including one surface; forming a first mask layer having a first etching window formed on the top surface of the semiconductor substrate, an inclination angle between a direction of one side wall of the etching window and a direction of a crystal grating of the semiconductor substrate being 0 to 45° or 45 to 90°; carrying out anisotropic etching (selected anisotropic etching) on the semiconductor substrate through the first mask layer and the etching window to form a slant surface on the semiconductor substrate along the direction of the one side wall of the etching window; and forming a micro diffractive optical structure on the slant surface. COPYRIGHT: (C)2011,JPO&INPIT