METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To securely mount a chip in a short time. SOLUTION: A film adhesive 21 put into a B stage is provided on a substrate 10, and a chip 1 is temporarily fixed to the substrate 10 with the film adhesive 21 interposed. Further, a sealing film 41 is pressed by a press head 43 after being supplied onto the chip 1. The temperature of the press head 43 is adjusted to soften only the sealing film 41 first, and the material of the sealing film 41 is charged in a space 40 between chips 1. Then the temperature of the press head 43 is raised to soften the film adhesive 21, and a bump 2 and an electrode pad 13A are connected. The temperature of the press head 43 is raised thereafter to put the film adhesive 21 and sealing film 41 into a C stage. COPYRIGHT: (C)2011,JPO&INPIT