ANISOTROPIC CONDUCTIVE FILM, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE USING THE SAME

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film which is excellent in preservation stability while attaining cold curing by a quick curing property, and a manufacturing method for a connection structure for manufacturing a connection structure having high conductive reliability by us...

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Bibliographische Detailangaben
1. Verfasser:	KOMURO KATSUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an anisotropic conductive film which is excellent in preservation stability while attaining cold curing by a quick curing property, and a manufacturing method for a connection structure for manufacturing a connection structure having high conductive reliability by using the anisotropic conductive film. SOLUTION: The anisotropic conductive film 1 is formed by laminating a first resin layer 1A including an oxetane compound and a second resin layer 1B including a cationic initiator in sequence. At least one of the first resin layer 1A and the second resin layer 1B of the anisotropic conductive film 1 includes conductive particles, and the first resin layer 1A or the second resin layer 1B includes a phosphine oxide compound. COPYRIGHT: (C)2011,JPO&INPIT