PHOTOSENSITIVE RESIN COMPOSITION, SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with which a step to form structures different in height is simplified to drastically reduce time and cost, and which can obtain a liquid crystal display device having excellent display quality without causing any image persistence...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO TAKUMI, YATO YOSHIKI, NAKANO YOSHIHIRO, KADOTA SOHEI, DEMACHI YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with which a step to form structures different in height is simplified to drastically reduce time and cost, and which can obtain a liquid crystal display device having excellent display quality without causing any image persistence even when a voltage is applied thereto for a long period of time. SOLUTION: The photosensitive resin composition is for forming a plurality of structures with different heights on either one of opposing faces of a pair of substrates of the liquid crystal display device, and includes an alkali-soluble resin, an epoxy resin with an aromatic ring structure, a polyfunctional polymerizable monomer, and a photo-polymerization initiator, wherein the amount of the epoxy resin with respect to total solid components of the photosensitive resin composition is 10-40 wt.%. COPYRIGHT: (C)2011,JPO&INPIT