METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, which can improve operability when APC (Advanced Process Control) is performed by the unit of a semiconductor wafer. SOLUTION: For example, when a resist pattern size is measured after exposure processing targeting this time's lot (#1) to calculate exposure conditions by each unit of semiconductor wafers in a next time's lot (#2) while reflecting measured values, a state wherein an exposure starting sheet number of this time's lot (#1) is not enough or a state wherein a measurement sheet number in this time's lot (#1) is insufficient may occur. There, in a state where the exposure starting sheet number is not enough (for example, a state where slots 11 and 12 among slots 1 to 12 do not exist), measured values of 12 semiconductor wafers are derived using extrapolation calculation based on an approximate expression, and when the measurement sheet number is insufficient (for example, a state where only the measurement sheet number for the slots 1, 6, and 12 among the slots 1 to 12 are obtained), 12 semiconductor wafers measured values are derived using interpolation calculation based on an approximate expression. COPYRIGHT: (C)2011,JPO&INPIT