METAL COATED POLYIMIDE FILM AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a metal coated polyimide film capable of corresponding to the fine-pitching of an electronic circuit, extremely reduced in the number of pinholes, having high folding resistance and superior in dimensional stability, and a method for manufacturing the same. SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	OGASAWARA SHUICHI, SONE HIROBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal coated polyimide film capable of corresponding to the fine-pitching of an electronic circuit, extremely reduced in the number of pinholes, having high folding resistance and superior in dimensional stability, and a method for manufacturing the same. SOLUTION: When a substrate metal layer composed of a nickel-chromium alloy layer and a copper layer is provided on the surface of a polyimide film by a dry plating method according to a reel-to-reel system and a copper plating layer is provided on the substrate metal layer, the part coming into contact with a feed device is set to only the surface of the polyimide film in the feed during the period until the polyimide film having the substrate metal layer formed thereon is taken up by a roll after the nickel-chromium alloy layer is provided on the surface of the polyimide film. COPYRIGHT: (C)2011,JPO&INPIT