INSPECTION METHOD OF PROBE CARD, INSPECTION METHOD OF SEMICONDUCTOR DEVICE AND PROBE CARD

PROBLEM TO BE SOLVED: To provide an inspection method of a probe card, which enables a user to correctly know a replacement time of the probe card, based on a result of a conduction test in the probe card. SOLUTION: The inspection method of the probe card attached to a semiconductor inspection apparatus for electrically testing a chip area formed in a semiconductor wafer has: a conduction test process for bringing an electrode terminal in the chip area into contact with a probe needle of the probe card, flowing a current in the chip area, and measuring a voltage value; a calculation process for calculating a standard deviation of the measured voltage value; and a determination process for determining whether a standard deviation value is within a predetermined range or not. If the standard deviation value exceeds the predetermined range, a display provided in the probe card informs the user of a replacement of the probe card attached to the semiconductor inspection apparatus with a new probe card. COPYRIGHT: (C)2011,JPO&INPIT