FILM LAMINATE, PASTING METHOD OF FILM LAMINATE, CONNECTION METHOD AND CONNECTION STRUCTURE USING FILM LAMINATE

PROBLEM TO BE SOLVED: To paste at an electrode terminal part of a substrate with an extremely narrow width without generating any inconvenience to pasting conditions. SOLUTION: A film laminate 1 has a peeling film 3 whose width is larger than that of an anisotropic conductive film 2, and one side al...

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Bibliographische Detailangaben
1. Verfasser:	KONISHI MISAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To paste at an electrode terminal part of a substrate with an extremely narrow width without generating any inconvenience to pasting conditions. SOLUTION: A film laminate 1 has a peeling film 3 whose width is larger than that of an anisotropic conductive film 2, and one side along with a longitudinal direction of the peeling film 3 overlaps with one side along with the longitudinal direction of the anisotropic conductive film 2. COPYRIGHT: (C)2011,JPO&INPIT