ELECTROFORMING BLADE

PROBLEM TO BE SOLVED: To provide an electroforming blade solving problems of warpage and rigidity insufficiency by increasing grain sizes of abrasive grains, securing sufficient cutting performance, also when cutting a material having fast cutting speed and discharging many cutting chips, such as ce...

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Bibliographische Detailangaben
1. Verfasser: NISHIDA KEIZO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electroforming blade solving problems of warpage and rigidity insufficiency by increasing grain sizes of abrasive grains, securing sufficient cutting performance, also when cutting a material having fast cutting speed and discharging many cutting chips, such as ceramics or a glass epoxy board before baking, and causing no blade thinning. SOLUTION: This electroforming blade includes a grinding stone part having the abrasive grains fixed by a plating layer. The electroforming blade is made to have a structure easily discharging chip by increasing the size of a chip pocket by arranging the abrasive grains having almost the same size as a thickness dimension of the blade with a two-dimensional regularity in a blade outer diameter direction in a range of an inter-abrasive grain distance of 0.5 to 3 mm. By improving wear resistance through the increase of the abrasive grain sizes, blade reduction of the blade under high speed cutting is suppressed. COPYRIGHT: (C)2011,JPO&INPIT