SURFACE PROTECTIVE SHEET

PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for...

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Hauptverfasser: SASAKI TAKATOSHI, KAWASHIMA NORIYOSHI, ASAI FUMITERU
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creator SASAKI TAKATOSHI
KAWASHIMA NORIYOSHI
ASAI FUMITERU
description PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for a semiconductor wafer having the protruding electrode of 10 to 150 μm height on its surface, and includes an adhesive layer having a plurality of layers on one side of a base film. The adhesive layer has a 25°C storage modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less in peeling off the surface protective sheet. COPYRIGHT: (C)2011,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011023396A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011023396A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011023396A3</originalsourceid><addsrcrecordid>eNrjZJAIDg1yc3R2VQgI8g9xdQ7xDHNVCPZwdQ3hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBkbGxpZmjsZEKQIAOasgMA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE PROTECTIVE SHEET</title><source>esp@cenet</source><creator>SASAKI TAKATOSHI ; KAWASHIMA NORIYOSHI ; ASAI FUMITERU</creator><creatorcontrib>SASAKI TAKATOSHI ; KAWASHIMA NORIYOSHI ; ASAI FUMITERU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for a semiconductor wafer having the protruding electrode of 10 to 150 μm height on its surface, and includes an adhesive layer having a plurality of layers on one side of a base film. The adhesive layer has a 25°C storage modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less in peeling off the surface protective sheet. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110203&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011023396A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110203&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011023396A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SASAKI TAKATOSHI</creatorcontrib><creatorcontrib>KAWASHIMA NORIYOSHI</creatorcontrib><creatorcontrib>ASAI FUMITERU</creatorcontrib><title>SURFACE PROTECTIVE SHEET</title><description>PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for a semiconductor wafer having the protruding electrode of 10 to 150 μm height on its surface, and includes an adhesive layer having a plurality of layers on one side of a base film. The adhesive layer has a 25°C storage modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less in peeling off the surface protective sheet. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIDg1yc3R2VQgI8g9xdQ7xDHNVCPZwdQ3hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBkbGxpZmjsZEKQIAOasgMA</recordid><startdate>20110203</startdate><enddate>20110203</enddate><creator>SASAKI TAKATOSHI</creator><creator>KAWASHIMA NORIYOSHI</creator><creator>ASAI FUMITERU</creator><scope>EVB</scope></search><sort><creationdate>20110203</creationdate><title>SURFACE PROTECTIVE SHEET</title><author>SASAKI TAKATOSHI ; KAWASHIMA NORIYOSHI ; ASAI FUMITERU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011023396A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SASAKI TAKATOSHI</creatorcontrib><creatorcontrib>KAWASHIMA NORIYOSHI</creatorcontrib><creatorcontrib>ASAI FUMITERU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SASAKI TAKATOSHI</au><au>KAWASHIMA NORIYOSHI</au><au>ASAI FUMITERU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE PROTECTIVE SHEET</title><date>2011-02-03</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for a semiconductor wafer having the protruding electrode of 10 to 150 μm height on its surface, and includes an adhesive layer having a plurality of layers on one side of a base film. The adhesive layer has a 25°C storage modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less in peeling off the surface protective sheet. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
title SURFACE PROTECTIVE SHEET
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T10%3A49%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SASAKI%20TAKATOSHI&rft.date=2011-02-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011023396A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true