SURFACE PROTECTIVE SHEET

PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for...

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Bibliographische Detailangaben
Hauptverfasser:	SASAKI TAKATOSHI, KAWASHIMA NORIYOSHI, ASAI FUMITERU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a surface protective sheet that has improved follow-up ability to a protruding electrode, thereby having an excellent adhesion to a wafer, and effectively prevents a wafer from being broken in peeling off the sheet. SOLUTION: The surface protective sheet is used for a semiconductor wafer having the protruding electrode of 10 to 150 μm height on its surface, and includes an adhesive layer having a plurality of layers on one side of a base film. The adhesive layer has a 25°C storage modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less in peeling off the surface protective sheet. COPYRIGHT: (C)2011,JPO&INPIT