HEAD FOR MOUNTING ELECTRONIC COMPONENT, NOZZLE FOR SUCKING ELECTRONIC COMPONENT, AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a nozzle for sucking an electronic component, the nozzle achieving high-density mounting without interfering with a previously mounted component even when displacement occurs in sucking and mounting a minute chip component; and to provide a head for sucking an electr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUROISHI KYOMI, FUKUSHIMA YOSHIHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a nozzle for sucking an electronic component, the nozzle achieving high-density mounting without interfering with a previously mounted component even when displacement occurs in sucking and mounting a minute chip component; and to provide a head for sucking an electronic component or a device for supplying an electronic component.SOLUTION: In this suction nozzle including a suction hole 10h for sucking a rectangular minute chip component 3 particularly having a long side ≤1.6 mm, and a suction passage communicating with the suction hole 10h, or this head for mounting an electronic component including the suction nozzle, the suction area of a suction surface 15 of a tip 10 of the suction nozzle is smaller than an area of a suction object surface of the minute chip component 3.