JOINING METHOD OF METAL SUBSTRATE AND GLASS SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for joining a glass substrate and a metal substrate without causing deformation due to thermal expansion difference.SOLUTION: In the method for joining the metal substrate 25 and the glass substrate 20 via a sealing material 29, the glass substrate 20 is hea...

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Bibliographische Detailangaben
Hauptverfasser:	KURASHIMA HIDEO, ONOZAWA YASUTETSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for joining a glass substrate and a metal substrate without causing deformation due to thermal expansion difference.SOLUTION: In the method for joining the metal substrate 25 and the glass substrate 20 via a sealing material 29, the glass substrate 20 is heated to raise its temperature, and in this state, the glass substrate 20 is pressed against the surface of the metal substrate 25 on which the sealing material 29 is arranged, and at the same time, the metal substrate 25 is heated up to the melting point or more of the sealing material 29, and then heating of the metal substrate 25 is stopped, and the metal substrate 25 is selectively cooled.