CHEMICALLY AMPLIFIED RESIST MATERIAL AND PATTERN FORMATION METHOD USING THE SAME
PROBLEM TO BE SOLVED: To provide a pattern formation method that reduces roughness produced on a resist pattern to make the pattern have a good shape.SOLUTION: At first, a resist film 102 is formed from a chemically amplified resist material onto a substrate 101. The resist film 102 is irradiated wi...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a pattern formation method that reduces roughness produced on a resist pattern to make the pattern have a good shape.SOLUTION: At first, a resist film 102 is formed from a chemically amplified resist material onto a substrate 101. The resist film 102 is irradiated with an exposure light comprising extreme ultraviolet light in a selective manner to achieve pattern exposure. The resist film 102 that has been subjected to pattern exposure is heated, and the heated resist film 102 is developed to form a resist pattern 102a from the resist film 102. The chemically amplified resist material comprises a block polymer comprising a first monomer unit and a second monomer unit, wherein the first monomer unit has an onium salt having an anionic moiety and a cationic moiety and contains a group covalently bound to a sulfonate group that is the anionic moiety, and wherein the second monomer unit contains an acid leaving group. |
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