METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL

PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of...

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1. Verfasser:	SHIBATA YASUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator	SHIBATA YASUFUMI
description	PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of a base material in the thickness of ≤1.5 μm, a stress more than the yield stress of the metallic layer material is added to the plated layer.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011017062A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011017062A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011017062A3</originalsourceid><addsrcrecordid>eNrjZEjzdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cI8HEMcXUBCoa4Bnk6-ih4OIYhCfs4RroGgTQF5yn4B4FIRx8f_0gdBUc_F4UQD1d07TwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjA0NDA0NzAzMjRmChFAOXDNPI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL</title><source>esp@cenet</source><creator>SHIBATA YASUFUMI</creator><creatorcontrib>SHIBATA YASUFUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of a base material in the thickness of ≤1.5 μm, a stress more than the yield stress of the metallic layer material is added to the plated layer.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011017062A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011017062A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIBATA YASUFUMI</creatorcontrib><title>METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL</title><description>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of a base material in the thickness of ≤1.5 μm, a stress more than the yield stress of the metallic layer material is added to the plated layer.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEjzdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cI8HEMcXUBCoa4Bnk6-ih4OIYhCfs4RroGgTQF5yn4B4FIRx8f_0gdBUc_F4UQD1d07TwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjA0NDA0NzAzMjRmChFAOXDNPI</recordid><startdate>20110127</startdate><enddate>20110127</enddate><creator>SHIBATA YASUFUMI</creator><scope>EVB</scope></search><sort><creationdate>20110127</creationdate><title>METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL</title><author>SHIBATA YASUFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011017062A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIBATA YASUFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIBATA YASUFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL</title><date>2011-01-27</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of a base material in the thickness of ≤1.5 μm, a stress more than the yield stress of the metallic layer material is added to the plated layer.</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title	METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T09%3A48%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIBATA%20YASUFUMI&rft.date=2011-01-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011017062A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true