METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL

METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL

PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of...

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Bibliographische Detailangaben
1. Verfasser: SHIBATA YASUFUMI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a plated material capable of controlling the generation of a whisker and having an extremely thin plated layer of Sn or Sn alloy, and to provide the plated material.SOLUTION: After the plated layer of Sn or Sn alloy is formed on a surface of a base material in the thickness of ≤1.5 μm, a stress more than the yield stress of the metallic layer material is added to the plated layer.