CONDUCTIVE PASTE, AND MEMBRANE WIRING BOARD

PROBLEM TO BE SOLVED: To provide conductive paste and a membrane wiring board capable of forming a circuit layer having excellent conductivity even if it is covered with an insulating coating layer, and sufficiently suppressing deterioration of conductivity even if it is brought into a bent state.SO...

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1. Verfasser: ONO AKINOBU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide conductive paste and a membrane wiring board capable of forming a circuit layer having excellent conductivity even if it is covered with an insulating coating layer, and sufficiently suppressing deterioration of conductivity even if it is brought into a bent state.SOLUTION: The conductive paste contains a binder resin and conductive powder. The conductive powder is made up of flaky silver particles and spherical silver particles, and the proportion of the spherical silver particles in the conductive powder is >0 mass% and ≤15 mass%.