METHOD OF MANUFACTURING CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board in which deviation in an area of a second electrode in contact with a dielectric layer can be minimized, so that an electrostatic capacitance error of the capacitor can...

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Bibliographische Detailangaben
Hauptverfasser:	KIM HONG-WON, YI SUNG, KEN NEIDO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board in which deviation in an area of a second electrode in contact with a dielectric layer can be minimized, so that an electrostatic capacitance error of the capacitor can be decreased.SOLUTION: The capacitor-embedded printed circuit board includes an insulating layer, a first electrode formed at one side of the insulating layer, a second electrode formed at one side of the first electrode, a dielectric layer formed at one side of the second electrode, and a third electrode formed at one side of the dielectric layer, so that the electrode of the capacitor is formed in a dual structure having the second electrode formed at the one side of the first electrode.