METHOD FOR PRODUCING COPPER ALLOY STRIP

METHOD FOR PRODUCING COPPER ALLOY STRIP

PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy strip, when three layer plating of Ni/Cu/Sn is applied to the surface of a copper alloy strip, and thereafter, reflowing treatment is performed, after the reflowing, an Sn or Sn alloy layer is left on the outermost surface, and i...

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Bibliographische Detailangaben
Hauptverfasser: TONG CHINGPING, OKAMOTO MASAHIDE, MURASATO YUKI, TONOKI TATSUYA
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy strip, when three layer plating of Ni/Cu/Sn is applied to the surface of a copper alloy strip, and thereafter, reflowing treatment is performed, after the reflowing, an Sn or Sn alloy layer is left on the outermost surface, and intermetallic compound phases are not exposed to the surface.SOLUTION: In the method for producing a copper alloy strip, plating of an Ni layer 2 is applied to the surface of a Cu alloy base material 1, successively, Cu plating of a Cu layer 3 and Sn plating of an Sn layer 4 are applied thereto in such a manner that the ratio of the Sn plating thickness/the Cu plating thickness is controlled to ≤6, and thereafter, reflowing treatment is performed.