RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, AND LAMINATED BOARD

PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board in which the dielectric constant and dielectric loss tangent are low, and which has outstanding heat resistance and outstanding adhesion, and to provide a prepreg and a laminated board using the same.SOLUTION: The resin composi...

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Bibliographische Detailangaben
1. Verfasser:	TOBISAWA AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board in which the dielectric constant and dielectric loss tangent are low, and which has outstanding heat resistance and outstanding adhesion, and to provide a prepreg and a laminated board using the same.SOLUTION: The resin composition for a circuit board includes: a compound which contains two or more maleimide groups in the molecule; a 2, 2, 4-trimethyl-1, 2-dihydroquinoline polymerized material; a bisphenol S compound, and is characterized in that the dielectric loss tangent at 1 GHz of the cured product of the resin composition for a circuit boards is 0.005-0.015.