PROCESS OF MAKING POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a process of making a polyimide film having little inorganic particle aggregation.SOLUTION: The process of making a polyimide film includes casting a polyamic acid solution containing polyamic acid obtained by reacting an aromatic diamine with aromatic acid dianhydri...

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Bibliographische Detailangaben
Hauptverfasser:	KANESHIRO NAGAYASU, URABE TAKASHI, HOSOGAI SEIJI, SHIMIZU MASAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a process of making a polyimide film having little inorganic particle aggregation.SOLUTION: The process of making a polyimide film includes casting a polyamic acid solution containing polyamic acid obtained by reacting an aromatic diamine with aromatic acid dianhydride, onto a substrate; forming a film; and imidizing the film. The polyimide film containing inorganic particles is directly added to a polyamic acid solution in a polymerization tank, under an condition that the inorganic particles are dispersed in an organic solvent or at least in a solution which contains an organic solvent.