RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide high thixotropy to a resin composition for sealing an optical semiconductor using as an epoxy base resin triglycidyl isocyanurates, and to provide good transparency, good crack resistance and good heat resistant endurance to its cured product at the same time as time...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	UMAGOE HIDEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide high thixotropy to a resin composition for sealing an optical semiconductor using as an epoxy base resin triglycidyl isocyanurates, and to provide good transparency, good crack resistance and good heat resistant endurance to its cured product at the same time as time passes.SOLUTION: The resin composition for sealing the optical semicondutor includes an epoxy component including triglycidyl isocyanurates, an acid anhydride curing agent, a (meth)acrylate resin containing a glycidyl group and having a 20,000-65,000 weight average molecular weight and a 100-10,000 Pa s viscosity, and a curing accelerator. It has a 10-200 Pa s viscosity and a 3-15 thixotropic index.