SILICONE UNDERFILL MATERIAL FOR FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a silicone underfill material for flip chip type light-emitting semiconductor devices, using a silicone excellent in heat resistance and light resistance and higher in a coefficient of linear expansion than an epoxy resin and lowered in elasticity, and to provide the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KASHIWAGI TSUTOMU, KODAMA KINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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