SILICONE UNDERFILL MATERIAL FOR FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a silicone underfill material for flip chip type light-emitting semiconductor devices, using a silicone excellent in heat resistance and light resistance and higher in a coefficient of linear expansion than an epoxy resin and lowered in elasticity, and to provide the flip chip type light-emitting semiconductor device using the underfill material.SOLUTION: There is provided the silicone underfill material for flip chip type light-emitting semiconductor devices, which comprises a curable silicone composition containing (A) 100 pts.mass of a thermosetting type liquid silicone resin composition and (B) 100 to 400 pts.mass of a spherical inorganic filler having particle diameters of ≤50 μm and an average particle diameter of 0.5 to 10 μm, and gives a cured product having a hardness (type A) of ≤40 at 25°C, a Young's modulus of ≤2.0 MPa and a coefficient of linear expansion of ≤250 ppm. There is provided the flip chip type light-emitting semiconductor device to which the underfill material has been applied.