RESOL TYPE PHENOLIC RESIN, PRODUCTION METHOD AND USAGE OF THE SAME

PROBLEM TO BE SOLVED: To provide a resol type phenolic resin excellent in low temperature adhesiveness, suitable for manufacturing thick plywood having a thickness of 15 mm or more at a temperature of as low as about 120°C, excellent in the productivity of plywood, and to provide a production method...

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Bibliographische Detailangaben
1. Verfasser:	SHIODA YOZO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW ORSIMILAR MATERIALS CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FORIMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILARMATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITHPERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resol type phenolic resin excellent in low temperature adhesiveness, suitable for manufacturing thick plywood having a thickness of 15 mm or more at a temperature of as low as about 120°C, excellent in the productivity of plywood, and to provide a production method and usage of the resin.SOLUTION: The resol type phenolic resin has a content of not more than 6% of mononuclear and binuclear compounds in terms of an area ratio on a gel permeation chromatogram (GPC) chart of a THF-soluble component.