HEAT-CONDUCTIVE POLYIMIDE MOLDING, AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a polyimide molding having thickness-directional high heat conductivity.SOLUTION: This heat-conductive polyimide molding is manufactured by a method including a process (A) for applying a polyamic acid solution dispersed with a nonspherical heat-conductive filler, on...

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Bibliographische Detailangaben
1. Verfasser:	TAKAYAMA YOSHINARI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide molding having thickness-directional high heat conductivity.SOLUTION: This heat-conductive polyimide molding is manufactured by a method including a process (A) for applying a polyamic acid solution dispersed with a nonspherical heat-conductive filler, onto a support body, to form an applied film, a process (B) for drying the applied film while applying a magnetic field along a thickness direction of the applied film, and for obtaining a polyamic acid film, and a process (C) for setting the obtained polyamic acid film in a molding die to be imidized.