ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device package. SOLUTION: The manufacturing method of an electronic device has a step of covering a first surface of its metal layer by a first insulating layer; a step of covering a second and opposite-side surface of the meta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOW QWAI, VARIOT PATRICK
Format: Patent
Sprache:eng
Schlagworte:
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