ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device package. SOLUTION: The manufacturing method of an electronic device has a step of covering a first surface of its metal layer by a first insulating layer; a step of covering a second and opposite-side surface of the metal layer by a second insulating layer; a step wherein, in order that a bonding location is exposed in the first surface of the metal layer so that a remaining portion of the second insulating layer existing on the second opposite-side surface is disposed in the opposite side of the bonding position of the first surface, the first insulation layer is patterened; a step of pattern-forming a second insulating layer; a step of selectively removing the portion of the metal layer which is not covered by the remaining portion of the second insulating layer on the second opposite-side surface, in order to form the metal layer present on a separated same pattern, wherein the metal layer existing on the separated same surface includes the bonding position, and a step of selectively removing the remaining portion of the second insulating layer, and exposing second bonding positions on the second opposite-side surface of the metal layer existing on the separated same surface. COPYRIGHT: (C)2011,JPO&INPIT