BONDING WIRE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a bonding wire that can keep smoothness of unreeling over a long period, without covering the surface of the bonding wire with an organic substance, such as, surface-activating agent or oil-and-fat. SOLUTION: After dissolving and casting gold alloy whose boron additi...

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1. Verfasser: ITO MIKIHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bonding wire that can keep smoothness of unreeling over a long period, without covering the surface of the bonding wire with an organic substance, such as, surface-activating agent or oil-and-fat. SOLUTION: After dissolving and casting gold alloy whose boron addition amount falls within a predetermined range and obtaining ingot, a rolling process and a wire drawing process are carried out to the ingot; and thereafter, by carrying out heat treatment in an oxidizing atmosphere, a bonding wire on whose surface a boron oxide film is formed is obtained. COPYRIGHT: (C)2011,JPO&INPIT