SUBSTRATE TREATING DEVICE, AND METHOD OF TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate treatment technique appropriately controlling a pressure in a treatment vessel for setting the pressure to a desired pressure state by controlling a flow of gas in a treatment vessel for treating substrates. SOLUTION: A substrate treating device 1 introdu...

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Bibliographische Detailangaben
1. Verfasser:	SAITO YUKIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate treatment technique appropriately controlling a pressure in a treatment vessel for setting the pressure to a desired pressure state by controlling a flow of gas in a treatment vessel for treating substrates. SOLUTION: A substrate treating device 1 introduces treatment gas into the treatment vessel 2 and exhausts air for treating a substrate G placed on a mount table 4 in the treatment vessel 2. The substrate treating device 1 includes: a partitioning member 6 for partitioning the periphery of the mount table 4 into a plurality of regions 15 in the treatment vessel 2; a plurality of air outlets 5 that are provided at each of a plurality of regions 15 partitioned by the partitioning member 6 on a bottom face 2a of the treatment vessel 2 and exhaust treatment gas; an exhaust mechanism 55 that is connected to each of the plurality of air outlets 5 for operating individually; a sensor 47 for detecting pressure in each region 15; and a control unit 45 for individually controlling the exhaust mechanism 55, based on pressure detected by the sensor 47. COPYRIGHT: (C)2011,JPO&INPIT