GAS-WIPING DEVICE

PROBLEM TO BE SOLVED: To provide a gas-wiping device which can improve the productivity by enabling maintenance including a replacement of a wiping nozzle without shutting down a line or cutting the steel plate. SOLUTION: The gas-wiping device 11 is used for adjusting the mass of a plated film by je...

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Bibliographische Detailangaben
Hauptverfasser:	FUJIOKA HIRONORI, YOSHIKAWA MASASHI, YONEKURA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a gas-wiping device which can improve the productivity by enabling maintenance including a replacement of a wiping nozzle without shutting down a line or cutting the steel plate. SOLUTION: The gas-wiping device 11 is used for adjusting the mass of a plated film by jetting a gas from the wiping nozzle 12 toward the front surface and the rear surface of a strip S which travels upward from a hot-dip plating bath 10. The wiping nozzle 12 is supported so as to be linearly movable for a distance of the nozzle width or longer toward the sheet width direction of the strip S. COPYRIGHT: (C)2011,JPO&INPIT