METHOD OF APPLYING PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROTECTION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROTECTION FOR USE IN THE APPLICATION METHOD

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet excellent in holding properties after wafer grinding, for conforming to irregularities even a semiconductor wafer has large level differences of the irregularities, and preventing breaking of the semiconductor wafer and intrusion o...

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Bibliographische Detailangaben
Hauptverfasser:	KAWASHIMA NORIYOSHI, ASAI FUMITERU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet excellent in holding properties after wafer grinding, for conforming to irregularities even a semiconductor wafer has large level differences of the irregularities, and preventing breaking of the semiconductor wafer and intrusion of grinding water in wafer grinding. SOLUTION: The pressure-sensitive adhesive sheet 4 for a semiconductor wafer protection includes a pressure-sensitive adhesive layer 3 on one side of a substrate 1 and further includes at least one interlayer 2 between the substrate 1 and the pressure-sensitive adhesive layer 3, wherein the at least one of the interlayers 2 is made of a thermoplastic resin having a loss tangent (tanδ) of 0.5 or larger at a temperature of 50°C to 100°C. COPYRIGHT: (C)2011,JPO&INPIT