METHOD OF MANUFACTURING PHOTOELECTRIC CONVERTER

PROBLEM TO BE SOLVED: To solve the problem wherein damage is accumulated on the surface of a terminal section in an etching process, and failure, such as an increase in contact resistance and a decrease in adhesiveness, occurs since the terminal section that becomes a region electrically connected to the outside of a photoelectric converter is exposed to a dry etching atmosphere of a photodiode, a fluoric-acid-based wet etching atmosphere of a passivation layer, and the like during the manufacturing process and is also exposed to a plasma ashing atmosphere following separation of resist in each process. SOLUTION: For preventing accumulation of damage on the surface of a terminal section 10B by an etching process during a manufacturing process, an inorganic planarization layer 202 is allowed to remain until the final etching process (before a process for establishing a contact with the terminal section 10B). Damage by the etching process is absorbed by the inorganic planarization layer 202, thus preventing unneeded accumulation of damage to the terminal section 10B. COPYRIGHT: (C)2011,JPO&INPIT