ELECTRONIC COMPONENT ASSEMBLY METHOD, AND RESTRAINT JIG USED FOR THE SAME

PROBLEM TO BE SOLVED: To provide an electronic component assembling method, which can attach a heat radiation unit, without making electronic components produce mechanical stresses, and to provide a restraint jig used for the method. SOLUTION: In a supporter 6 that restrains electronic components 2 to a substrate 1, a restrained surface 6a corresponding to a plane that includes each heat dissipation surface 4 for electronic components 2a to 2d is formed. The supporter 6 is formed of material having a linear expansion coefficient sufficiently smaller than that of the substrate 1. The supporter 6 is mounted on the electronic components 2a to 2d such that the restrained surface 6a contacts the heat-dissipating surface 4 and the supporter 6 is fixed to the substrate 1, in a state where the electronic components are sandwiched by the supporter 6 and the substrate 1. Then in such a state, the electronic components are is immersed in a soldering bath and are soldered to the substrate. COPYRIGHT: (C)2011,JPO&INPIT