INTERPOSER AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE INTERPOSER AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an interposer which is not curved even when a through-hole is formed by irradiation with laser light and a method of manufacturing the same, and to provide a semiconductor device using the same and a method of manufacturing the same. SOLUTION: A through-hole 5 formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IHARA SEIICHIRO, TERASAKI HIRONORI, TAIRA TOMOAKI, OGATA TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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