INTERPOSER AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE INTERPOSER AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an interposer which is not curved even when a through-hole is formed by irradiation with laser light and a method of manufacturing the same, and to provide a semiconductor device using the same and a method of manufacturing the same. SOLUTION: A through-hole 5 formed...

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Bibliographische Detailangaben
Hauptverfasser:	IHARA SEIICHIRO, TERASAKI HIRONORI, TAIRA TOMOAKI, OGATA TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an interposer which is not curved even when a through-hole is formed by irradiation with laser light and a method of manufacturing the same, and to provide a semiconductor device using the same and a method of manufacturing the same. SOLUTION: A through-hole 5 formed in a substrate core material 1 of the interposer includes a through-hole 5a formed from a semiconductor chip mounting side and a through-hole 5b formed from a mounting side. Those through-holes 5 are both arranged in a unit region constituting one semiconductor device. The interposer which is thus formed is free of curvature, and the semiconductor device having the interposer which is free of curvature is formed when the semiconductor device is formed using the interposer. COPYRIGHT: (C)2011,JPO&INPIT