PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM, AND PARTITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which provides a good pattern superior in pattern dimensional stability and the like even when obtaining a thick cured film and which is free from a reduction in volume resistance even when using a conductive material like carbon as...

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Hauptverfasser:	SASAKI KENRYO, ITAHARA SHUNEI, YOSHIOKA TAKAHIRO, FUJISHIRO KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which provides a good pattern superior in pattern dimensional stability and the like even when obtaining a thick cured film and which is free from a reduction in volume resistance even when using a conductive material like carbon as a light shielding component, and to provide a cured film and a partition which are formed using the photosensitive resin. SOLUTION: The photosensitive resin composition includes, as essential components, a photocurable resin and/or a photocurable monomer (1) and acrylic resin particles (2), wherein the acrylic resin particles (2) have an average primary particle size of 50 to 200 nm, and a weight ratio ((2)/(1)) of the acrylic resin particles (2) to the photocurable resin and/or the photocurable monomer (1) in the composition is 0.1 to 2.0. The cured film and the partition are formed using this photosensitive resin composition. COPYRIGHT: (C)2011,JPO&INPIT