THERMOSETTING RESIN COMPOSITION, PREPREG, COMPOSITE LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING

PROBLEM TO BE SOLVED: To provide a circuit board excellent in thermal conductivity, heat resistance, wear resistance against drilling, and flame retardancy. SOLUTION: A thermosetting resin composition is provided, which contains 80 to 140 parts by volume of an insulating inorganic filler in 100 part...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUZUE TAKAYUKI, NOZUE AKIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit board excellent in thermal conductivity, heat resistance, wear resistance against drilling, and flame retardancy. SOLUTION: A thermosetting resin composition is provided, which contains 80 to 140 parts by volume of an insulating inorganic filler in 100 parts by volume of a thermosetting resin. The inorganic filler comprises (A) gibbsite-form aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) inorganic particles which have an average particle diameter (D50) of 2 to 15 μm, contain crystal water having an isolation start temperature of 400°C or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of not more than 1.5 μm, with a compounding ratio (ratio by volume) of the gibbsite-form aluminum hydroxide particles (A), the inorganic particles (B) and the aluminum oxide particles (C) being 1:(0.1 to 1):(0.1 to 1). COPYRIGHT: (C)2011,JPO&INPIT