SUBSTRATE FOR SURFACE ACOUSTIC WAVE DEVICE AND SURFACE ACOUSTIC WAVE DEVICE

PROBLEM TO BE SOLVED: To provide a surface acoustic wave device excellent in airtightness. SOLUTION: The surface acoustic wave device 100 includes: a mounting substrate 102; a surface acoustic wave element 150 arranged oppositely over the top surface of the mounting substrate 102; pads 118 provided...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI TOYOSEI, FUJIWARA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a surface acoustic wave device excellent in airtightness. SOLUTION: The surface acoustic wave device 100 includes: a mounting substrate 102; a surface acoustic wave element 150 arranged oppositely over the top surface of the mounting substrate 102; pads 118 provided on the top surface of the mounting substrate 102; a solder layer 122 covering the pads 118; and a dam material 134 provided on the top surface of the mounting substrate 102 and surrounding the pads 118. COPYRIGHT: (C)2011,JPO&INPIT