SUBSTRATE WITH METAL FILM, AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To achieve good adhesiveness of a metal film and insulation layer even in a via hole. SOLUTION: The method for manufacturing a substrate with a metal film includes preparation of a first insulation layer 31, formation of a first conductive circuit 21 on the first surface of the first insulation layer 31, formation of a second insulation layer 32 on the first surface of the first insulation layer 31 and on the first conductive circuit 21, formation of a through-hole (a via hole 41) tapered from the first surface toward the first conductive circuit 21 in the second insulation layer 32, formation of a composition containing a polymerization initiator and a polymerizable compound on an inner wall of the through hole, formation of a graft polymer 411 on the inner wall of the through-hole by irradiating energy on the composition, application of a plating catalyst 412 on the graft polymer 411, and formation of an electroless-plated film 413 on the inner wall of the through hole. The first surface of the first insulation layer 31 faces to the second surface of the second insulation layer 32. COPYRIGHT: (C)2011,JPO&INPIT