SOLDER JET DEVICE

PROBLEM TO BE SOLVED: To provide a solder jet device which always maintains high solder quality by facilitating adjustment of solder jet height and enables reduced manufacturing cost of a product. SOLUTION: The solder jet device supplies fused solder by jetting the fused solder from a plurality of j...

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Bibliographische Detailangaben
1. Verfasser:	KAWASHIMA TAIJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder jet device which always maintains high solder quality by facilitating adjustment of solder jet height and enables reduced manufacturing cost of a product. SOLUTION: The solder jet device supplies fused solder by jetting the fused solder from a plurality of jet holes formed through a corrugated plate, wherein the corrugated plate has a plane portion covering a distal end of a jet nozzle and projection portions projecting upward from the plane portion at peripheral wall parts of the jet holes, and the projection portions have an angle of inclination of 15 to 60° with respect to a jetting direction of the fused solder, so that high and stable pressure of the solder jet at the jet hole is obtained, and the solder jet height is easily adjusted to always maintain high solder quality. COPYRIGHT: (C)2011,JPO&INPIT