MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a MEMS sensor facilitating formation of sticking prevention structure especially in structure where a sensor section is formed on an IC surface, and to provide a method of manufacturing the MEMS sensor. SOLUTION: The MEMS sensor includes: an IC 11; a protective layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWAI HIROAKI, UTSU YOSHITAKA, TAKAHASHI TORU, MIYATAKE TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PHYSICS SEMICONDUCTOR DEVICES TESTING
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