MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a MEMS sensor facilitating formation of sticking prevention structure especially in structure where a sensor section is formed on an IC surface, and to provide a method of manufacturing the MEMS sensor. SOLUTION: The MEMS sensor includes: an IC 11; a protective layer...

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Bibliographische Detailangaben
Hauptverfasser: KAWAI HIROAKI, UTSU YOSHITAKA, TAKAHASHI TORU, MIYATAKE TORU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a MEMS sensor facilitating formation of sticking prevention structure especially in structure where a sensor section is formed on an IC surface, and to provide a method of manufacturing the MEMS sensor. SOLUTION: The MEMS sensor includes: an IC 11; a protective layer 13 formed along irregularities on the surface of the IC; and a sensor section 14 formed on the protective layer 13. A sensor function section 19 including a movable electrode section 14a is provided at the sensor section 14. In the sensor function section 19, a surface 13a opposes the protective layer 13 comprising an irregular surface via a space 22. By utilizing irregularities on the surface of the IC, and forming a surface 13a of the protective layer 13 on the irregular surface along the irregularities, a contact area between the movable electrode section 14a and the protective layer 13 can be reduced, thus preventing sticking appropriately by simple structure. COPYRIGHT: (C)2011,JPO&INPIT