ONE-PACK ROOM-TEMPERATURE MOISTURE-CURING RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable resin composition that reduces the burden on the environment and that demonstrates stable curing speed while ensuring safety and that has excellent adhesion. SOLUTION: The curable resin composition comprises (1) 100 pts.mass of a curable resin (A) containin...

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Bibliographische Detailangaben
Hauptverfasser: SATO SHINICHI, KUSUKI KOJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a curable resin composition that reduces the burden on the environment and that demonstrates stable curing speed while ensuring safety and that has excellent adhesion. SOLUTION: The curable resin composition comprises (1) 100 pts.mass of a curable resin (A) containing an intramolecular urethane bond and a hydrolyzable silyl group represented by formula (1):-X-SiR1a(OR2)3-a(wherein X is ≥2C hydrocarbon; R1is 1-20C alkyl; R2is 1-3C alkyl; and a is 0, 1 or 2), (2) 5-400 pts.mass of a curable resin (B) containing a dialkoxysilyl group represented by formula (2):-W-CH2-SiR3(OR4)2(wherein W is a group selected from -O-CO-NH-, -N(R5)-CO-NH- and -S-CO-NH-; R3is 1-20C alkyl; R4is 1-3C alkyl; R5is hydrogen, optionally halogen-substituted cyclic, straight-chain or branched-chain 1-18C alkyl, alkenyl or 6-18C aryl), (3) 0.1-30 pts.mass of a basic compound (C) based on 100 pts.mass the total of the curable resin (A) and the curable resin (B) and (4) 10-500 pts.wt. of a plasticizer (D) that does not contain a hydroxy group in the molecule and has a boiling point of ≥200°C. COPYRIGHT: (C)2011,JPO&INPIT