METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module which improves electrical connection of a copper plate and a semiconductor device. SOLUTION: In the semiconductor module 1, a copper plate is etched and a bump electrode 110 and a recess are formed. An insulating resin...

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Bibliographische Detailangaben
Hauptverfasser:	OKAYAMA YOSHIHISA, ITO KATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module which improves electrical connection of a copper plate and a semiconductor device. SOLUTION: In the semiconductor module 1, a copper plate is etched and a bump electrode 110 and a recess are formed. An insulating resin layer 120 is formed to a position lower than the height of the bump electrode 115 in the recess. Then, a semiconductor device 210 and a copper plate including a wiring layer 135 formed integrally with the bump electrode 110 are pressure bonded. The wiring layer 135 is curved such that it is protruded to a semiconductor device 210 side. Accordingly, electrical connection of the bump electrode 110 and an element electrode 211 is secured. COPYRIGHT: (C)2011,JPO&INPIT