MOUNTING APPARATUS AND MOUNTING METHOD FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a mounting apparatus capable of mounting a semiconductor chip on a substrate at high precision. SOLUTION: The mounting apparatus includes a placing table 9 to which a substrate is supplied and placed, a component placement block 11 which moves together with the placing table 9 in an interlocked move to be positioned at a supply position at which a semiconductor chip is supplied and at an extraction position at which the semiconductor chip is extracted, an imaging camera 17 which takes images of the semiconductor chip and the substrate that are moved forward to the extraction position to be positioned there, and a mounting tool 26 which is so disposed at the extraction position as to be positioned vertically and horizontally freely, and as the imaging camera is retreated from the extraction position, is positioned horizontally within a range of a correction amount determined by an image of the semiconductor chip taken by the imaging camera to extract the semiconductor chip from the component placement block 11 and horizontally positions the semiconductor chip within the range of the correction amount determined by the image of the substrate taken by the imaging camera to mount the positioned semiconductor chip on the substrate. COPYRIGHT: (C)2011,JPO&INPIT