CONDUCTIVE INK, METHOD OF FORMING BUMP, AND ELECTRONIC COMPONENT

CONDUCTIVE INK, METHOD OF FORMING BUMP, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a conductive ink that improves the bondability between an electrode and a bump, and to provide a method of forming a bump and an electronic component. SOLUTION: The inductive ink 16 is provided for forming the bump 18 on the electrode 12 made of a base metal element...

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Bibliographische Detailangaben
Hauptverfasser: OTAKE KENSUKE, KIYONO SHINYA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a conductive ink that improves the bondability between an electrode and a bump, and to provide a method of forming a bump and an electronic component. SOLUTION: The inductive ink 16 is provided for forming the bump 18 on the electrode 12 made of a base metal element that is formed on an IC chip or a substrate 10 by a droplet ejection method using a droplet ejection head 14. The inductive ink 16 uses a solvent containing an organic compound that contains metal such as Ag nano-particles and an alcoholic hydroxy group. COPYRIGHT: (C)2011,JPO&INPIT