MULTILAYER WIRING SUBSTRATE, STACK STRUCTURE SENSOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate which can have a sensor component recycled even when a defect is caused during manufacturing processes, can improve connection strength of the sensor component, and can be made compact and thin; and to provide a stack structure sensor pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSUKUDA YUKIHIKO, NONOYAMA TATSU, NAITO NOBUO, SHIBUTA NORIKO, TERASAKI TATSU, YAMADA TOMOYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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