MULTILAYER WIRING SUBSTRATE, STACK STRUCTURE SENSOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate which can have a sensor component recycled even when a defect is caused during manufacturing processes, can improve connection strength of the sensor component, and can be made compact and thin; and to provide a stack structure sensor package, and a method of manufacturing the stack structure sensor package. SOLUTION: The multilayer wiring substrate 11A has a through hole 113 that passes from a first surface through to a second surface 112. The multilayer wiring substrate includes an electrical connection terminal IEL and OEL formed in at least one of an inner edge portion IEP side which is a periphery edge portion of the through hole, an outer edge portion OEP side which is an outer periphery edge portion of the substrate itself, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface. COPYRIGHT: (C)2011,JPO&INPIT